Patent · US Expired

Adhesive bond for densely ordered elements

US5863636A · kind A · utility

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0References

8Claims

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Assignee

International Business Machines Corporation · US

Inventors

Frank Druschke · Stuttgart, DE
Gerhard Elsner · Kaarst, DE
Johann Greschner · Neckartenzlingen, DE
Roland Stoehr · Nufringen, DE

Key dates

Filing date	Jul 2, 1997
Grant date	Jan 26, 1999
Priority date	—
Expiry date	Jul 2, 2017

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24322
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The invention relates to an adhesive bond 1 for a plurality of densely packed elements 4a, 4b, 4c guided into a plate pack 3. At the plate surface 2 with the adhesive bond 1 the guidance holes 5a are made larger than the guidance holes 5b in the remainder of the plate pack (3) and the adhesive bond is effected by means of a highly viscous adhesive. Because of the larger opening 5a, an adhesive reservoir 10 is formed at the plate surface 2. This makes it possible to use high viscosity adhesives. The geometric features and the use of a highly viscous adhesive make it possible to manufacture durable and heat-resistant adhesive bonds for elements such as wires, glass fibers or micromechanical components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.