Curable resin composition
US5863989A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1997 |
| Grant date | Jan 26, 1999 |
| Priority date | — |
| Expiry date | Apr 17, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J4/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition comprising: PA1 (1) a polymerizable vinyl monomer having a structure of the formula (A): EQU Z--R--(R.sub.2 O).sub.p --R.sub.1 (A) wherein Z is a (meth)acryloyl group, R.sub.1 is a phenyl group or a phenyl group having a C.sub.1-3 alkyl group, R.sub.2 is --C.sub.2 H.sub.4 --, --C.sub.3 H.sub.6 --, --CH.sub.2 CH(CH.sub.3)--, --C.sub.4 H.sub.8 -- or --C.sub.6 H.sub.12 --, and p is an integer of from 1 to 10 and wherein R is a direct bond, PA1 (2) a polymerizable vinyl monomer having a structure of the formula (B): ##STR1## wherein Z and R.sub.2 are as defined above, R.sub.3 is hydrogen or a C.sub.1-4 alkyl group, and q is an integer of from 0 to 8, PA1 (3) a polymerizable vinyl monomer having a structure of the formula (C): EQU Z--O--(R.sub.2 O).sub.p --H (C) wherein Z, R.sub.2 and p are as defined above, PA1 (4) an organic peroxide, and PA1 (5) a reducing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.