Koichi Taguchi
14Patents
5h-index
23Co-inventors
66Inventor score
Filing activity: Dec 27, 1991 → Sep 14, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5328947A | Two-part adhesive | Chemistry; Metallurgy | 23 | Expired |
| US5330844A | Adhesive composition and metal-bonded composite | Emerging Cross-Sectional Technologies | 10 | Expired |
| US5504676A | Slip processing method processing data from slips with varying formats | Physics | 8 | Expired |
| US5863989A | Curable resin composition | Chemistry; Metallurgy | 8 | Expired |
| US6420467B1 | Curable resin composition, adhesive composition, cured product and composite | Emerging Cross-Sectional Technologies | 7 | Expired |
| USRE36140E | Two-part adhesive | General | 3 | Expired |
| US6166146A | Curable resin composition, adhesive composition, bonded product, speaker and bonding method | Emerging Cross-Sectional Technologies | 2 | Expired |
| US10438865B2 | Semiconductor device | Electricity | 1 | Active |
| US11563380B2 | Power device drive apparatus and method for manufacturing the same | Electricity | 0 | Active |
| US7772295B2 | Resin compositions, cured article obtained therefrom, and sheet | Electricity | 0 | Active |
| US10763183B2 | Semiconductor device | Electricity | 0 | Active |
| US10505518B2 | Semiconductor device with substrate temperature monitor circuit | Electricity | 0 | Active |
| US12335628B2 | Imaging condition setting system, imaging condition setting method, and program | Physics | 0 | Active |
| US6312552A | Curable resin composition, adhesive composition, bonded product, speaker and bonding method | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.