Lead free conductive composites for electrical interconnections
US5866044A · kind A · utility
14Cited by
16References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1996 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Oct 21, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0783
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.