Emanuel I. Cooper
72Patents
13h-index
146Co-inventors
87Inventor score
Filing activity: Mar 8, 1984 → May 18, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5283104A | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5392177A | Sealed DASD having humidity control and method of making same | Physics | 37 | Expired |
| US6967131B2 | Field effect transistor with electroplated metal gate | Electricity | 33 | Expired |
| US7112851B2 | Field effect transistor with electroplated metal gate | Electricity | 30 | Expired |
| US5337475A | Process for producing ceramic circuit structures having conductive vias | Emerging Cross-Sectional Technologies | 25 | Expired |
| US8778210B2 | Compositions and methods for the selective removal of silicon nitride | Electricity | 21 | Active |
| US8026200B2 | Low pH mixtures for the removal of high density implanted resist | Electricity | 19 | Active |
| US8685909B2 | Antioxidants for post-CMP cleaning formulations | Chemistry; Metallurgy | 19 | Active |
| US7056648B2 | Method for isotropic etching of copper | Electricity | 18 | Expired |
| US5962384A | Method for cleaning semiconductor devices | Chemistry; Metallurgy | 18 | Expired |
| US5545429A | Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess | Electricity | 16 | Expired |
| US5866044A | Lead free conductive composites for electrical interconnections | Electricity | 14 | Expired |
| US8367555B2 | Removal of masking material | Emerging Cross-Sectional Technologies | 14 | Active |
| US6197222A | Lead free conductive composites for electrical interconnections | Electricity | 12 | Expired |
| US6613602B2 | Method and system for forming a thermoelement for a thermoelectric cooler | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7868410B2 | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow | Electricity | 12 | Active |
| US7060624B2 | Deep filled vias | Electricity | 12 | Expired |
| US6855240B2 | CoFe alloy film and process of making same | Electricity | 12 | Expired |
| US8618036B2 | Aqueous cerium-containing solution having an extended bath lifetime for removing mask material | Physics | 11 | Active |
| US7368045B2 | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow | Electricity | 10 | Expired |
| US9831088B2 | Composition and process for selectively etching metal nitrides | Electricity | 9 | Active |
| US7537709B2 | Method for isotropic etching of copper | Electricity | 8 | Expired |
| US7217655B2 | Electroplated CoWP composite structures as copper barrier layers | Electricity | 8 | Expired |
| US10138117B2 | Aqueous formulations for removing metal hard mask and post-etch residue with Cu/W compatibility | Electricity | 8 | Active |
| US7193323B2 | Electroplated CoWP composite structures as copper barrier layers | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.