Method of using an interface layer for stacked lamination sizing and sintering
US5866470A · kind A · utility
2Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1996 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Oct 8, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1911
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for making multiple microelectronic ceramic substrates uses an interface layer between stacked layers of green sheets that are laminated with the interface layer, then fired to produce the ceramic substrates. The interface layer acts to protect the substrates, and to hold them together before firing, then thermally degrades at a desired point in the firing cycle to separate the individual substrates. The invention also includes the ceramic substrates produced by the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.