Method and apparatus for polishing semiconductor substrate
US5866480A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1996 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Aug 26, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad is adhered to the top surface of a flat polishing pad holder of a platen. A substrate holding head for holding and rotating a semiconductor substrate is provided above the platen. The semiconductor substrate is rotated and pressed against the polishing pad on the platen. A slurry is supplied in a prescribed amount from a slurry supply pipe onto the polishing pad. A slat-like slurry pushing member for pushing the slurry to a central portion of the platen is provided slidably over the polishing pad. The slurry pushing member is fixed so that an inner portion thereof in a radial direction of the platen is downstream of an outer portion thereof in the radial direction of the platen in the direction of rotation of the platen during polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.