Method of and apparatus for cleaning workpiece
US5868866A · kind A · utility
76Cited by
25References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1996 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Mar 1, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of and an apparatus for cleaning a thin disk-shaped workpiece that is required to have a high degree of cleanliness, e.g., a semiconductor wafer, a glass substrate, a liquid crystal display, or the like. The method of cleaning the workpiece includes a plurality of cleaning steps, and comprises the steps of holding a workpiece, and performing a liquid jet cleaning of a surface of the workpiece in a first portion of plural cleaning steps. The method further comprises the step of performing a liquid jet cleaning of the surface of the workpiece in a latter portion of the plural cleaning steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.