Process for improving the adhesion of polymeric materials to metal surfaces
US5869130A · kind A · utility
89Cited by
11References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 12, 1997 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Jun 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a source of holide ions and optionally a water soluble polymer in order to increase the adhesion of polymeric materials to the metal surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.