Thin power tape ball grid array package
US5869889A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1997 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Apr 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package includes a heatspreader which is formed to have a centrally disposed recessed portion between planar surfaces, and flex tape extending from the planar surfaces into the centrally disposed surface. A semiconductor chip is mounted on the centrally disposed surface between the flex tape, and wire bonds interconnect bonding pads on the chip to the metal interconnect patterns on the flex tape. Plastic molding or epoxy is then applied to encapsulate the chip and wire bonding in the centrally disposed planar surface of the heat spreader. The package is then readily mounted on a motherboard using solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.