Method of forming a multilayer electronic packaging substrate with integral cooling channels
US5870823A · kind A · utility
143Cited by
17References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1996 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Nov 27, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49163
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the sintered ceramic body for cooling a heat-generating electronic device placed on the sintered body. Also disclosed is a method of making the electronic packaging substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.