Apparatus and method for rapid thermal processing

US5872889A · kind A · utility

Assignee

• Steag AST · DE

Inventors

• Guenter Kaltenbrunner · Baldham, DE
• Zsolt Nenyei · Blaustein, DE
• Helmut Sommer · Cologne, DE

Key dates

• Filing date: Jan 8, 1997
• Grant date: Feb 16, 1999
• Expiry date: Jan 8, 2017

Classification

• Technology area (CPC G): Physics
• CPC primary: G01J5/0003
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A closable enclosure for rapid thermal processing of semiconductor wafers is presented, wherein the closable enclosure has an enclosed volume less than 10 times the volume of the wafer, and wherein the closable enclosure may be closed about the wafer while the closable enclosure is surrounded by the process gas.