Method of electroplating a substrate, and products made thereby

US5873992A · kind A · utility

Assignee

• THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS · US

Inventors

• John H. Glezen · Palm Harbor, US
• Hameed A. Naseem · Fayetteville, US
• William D. Brown · Fayetteville, US
• Leonard W. Schaper · Fayetteville, US
• Ajay P. Malshe

Key dates

• Filing date: Mar 24, 1997
• Grant date: Feb 23, 1999
• Expiry date: Mar 24, 2017

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D5/605
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density J.sub.O, to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.