Multilayer printed circuit board with epoxy resin and carboxylated rubber as adhesive
US5874009A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1995 |
| Grant date | Feb 23, 1999 |
| Priority date | — |
| Expiry date | Aug 14, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered printed circuit board is produced by (a) forming a resin layer on an inner circuit substrate and abrading it to expose the circuit conductors, (b) contacting a copper foil having a layer of insulating adhesive composed of an epoxy resin, a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, a curing agent and accelerator with the resin layer and exposed circuit conductors, (c) removing portions necessary for connection with the copper foil and insulating adhesive exposed to the holes by etching, (d) connecting the copper foil with circuits exposed to the holes and forming a surface circuit by processing the outer layer of the copper foil, and (e) repeating steps (a) to (d) to obtained a multilayered structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.