Teiichi Inada
27Patents
13h-index
49Co-inventors
81Inventor score
Filing activity: Aug 14, 1995 → Oct 4, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6265782A | Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5690837A | Process for producing multilayer printed circuit board | Electricity | 38 | Expired |
| US6184577A | Electronic component parts device | Electricity | 35 | Expired |
| US6090468A | Multilayer wiring board for mounting semiconductor device and method of producing the same | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6673441B1 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | Emerging Cross-Sectional Technologies | 24 | Expired |
| US7070670B2 | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5874009A | Multilayer printed circuit board with epoxy resin and carboxylated rubber as adhesive | Electricity | 23 | Expired |
| US7875500B2 | Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support | Emerging Cross-Sectional Technologies | 21 | Active |
| US5935452A | Resin composition and its use in production of multilayer printed circuit board | Electricity | 19 | Expired |
| US8617930B2 | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device | Emerging Cross-Sectional Technologies | 18 | Active |
| US7968195B2 | Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler | Emerging Cross-Sectional Technologies | 17 | Active |
| US7968194B2 | Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler | Emerging Cross-Sectional Technologies | 17 | Active |
| US5965269A | Adhesive, adhesive film and adhesive-backed metal foil | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6621170B2 | Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6838170B2 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US8470115B2 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Emerging Cross-Sectional Technologies | 7 | Active |
| US7578891B2 | Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device | Emerging Cross-Sectional Technologies | 5 | Expired |
| US8465615B2 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Emerging Cross-Sectional Technologies | 5 | Active |
| US8840811B2 | Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same | Electricity | 4 | Active |
| US8017444B2 | Adhesive sheet, semiconductor device, and process for producing semiconductor device | Emerging Cross-Sectional Technologies | 3 | Active |
| US7947779B2 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | Emerging Cross-Sectional Technologies | 1 | Active |
| US8119737B2 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | Emerging Cross-Sectional Technologies | 1 | Active |
| US7772317B2 | Resin molding material | Chemistry; Metallurgy | 1 | Active |
| US8012580B2 | Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11535782B2 | Resin member and sheet using same, and heat storage material and heat control sheet using same | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.