Via hole profile and method of fabrication
US5874358A · kind A · utility
15Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1997 |
| Grant date | Feb 23, 1999 |
| Priority date | — |
| Expiry date | Feb 25, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/915
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A novel high performance and reliable interconnection structure for preventing via delamination. The interconnection structure of the present invention comprises a via connection which extends into and undercuts an underlying interconnection line to lock the via connection into the interconnection line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.