Shi-ning Yang
5Patents
5h-index
7Co-inventors
48Inventor score
Filing activity: Nov 27, 1991 → Feb 25, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5470790A | Via hole profile and method of fabrication | Emerging Cross-Sectional Technologies | 63 | Expired |
| US5619071A | Anchored via connection | Emerging Cross-Sectional Technologies | 47 | Expired |
| US5270256A | Method of forming a guard wall to reduce delamination effects | Electricity | 29 | Expired |
| US5874358A | Via hole profile and method of fabrication | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5986315A | Guard wall to reduce delamination effects within a semiconductor die | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.