Method of treating a semi-conductor wafer
US5874367A · kind A · utility
142Cited by
7References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 28, 1994 |
| Grant date | Feb 23, 1999 |
| Priority date | — |
| Expiry date | Dec 28, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing method relates to treating a semi-conductor wafer and in particular, but not exclusively, to planarization. The method consists of depositing a liquid short-chain polymer formed from a silicon containing gas or vapor. Subsequently water and OH are removed and the layer is stabilised.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.