Thermal stress relieving substrate
US5874776A · kind A · utility
78Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1997 |
| Grant date | Feb 23, 1999 |
| Priority date | — |
| Expiry date | Apr 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate for connecting one element having a first coefficient of thermal expansion to another element having a differing coefficient of thermal expansion that will alleviate interconnection problems due to thermal mismatch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.