Electronic package with strain relief means and method of making
US5877043A · kind A · utility
223Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1998 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Feb 23, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.