Process for coating an integrated circuit device with a molten spray
US5877093A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1995 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Oct 27, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of forming a primer coating and an opaque coating on an integrated circuit or multichip module. First a primer coating composition is applied to a surface of the integrated circuit device or multichip module to form a primer coating that increases the resistance of the surface to thermal and mechanical damage that may occur as a result of the application of the opaque coating. An opaque coating composition is then heated to a molten state and the molten opaque coating composition is applied over the primer coating to form an opaque coating that overlies active circuitry on the surface, to prevent optical and radiation based inspection and reverse engineering of the active circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.