Semiconductor device and method of manufacturing the same
US5877478A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 12, 1994 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Sep 12, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor substrate made of silicon or the like and having an active region is used as part of a package. Bumps are formed on a major surface of the semiconductor substrate. One end of each lead is connected to a corresponding bump, and the other end of the lead is located outside the major surface of the semiconductor substrate. An adhesive such as a thermoplastic resin is applied to the major surface of the semiconductor substrate. An upper substrate is located on the adhesive. The upper substrate is made of a metal plate, an insulating plate, or a semiconductor substrate. The upper substrate covers at least the active region of the semiconductor substrate, the bumps, and the lead portions on the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.