System and method for measuring the microroughness of a surface of a substrate
US5877860A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 13, 1996 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | May 13, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/303
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for measuring an amount of microroughness of a surface of a substrate, wherein a first beam of electromagnetic radiation and a second beam of electromagnetic radiation are generated, the first and second beams being substantially parallel and spaced apart from each other so that the first and second beams are substantially non-overlapping, and the first and second beams are focused onto the substrate so that the beams impinge upon a selected area of the surface of the substrate having a surface contour, the surface contour of the substrate causing a scattering of both beams. The scattering of the first and second beams is detected, the amount of scattering corresponding to a microroughness value of the selected area of the substrate, and the microroughness value of the selected area of the substrate is determined from the amount of scattering of the first and second beams. The microroughness measuring system may also be used for controlling a fabrication process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.