Patent · US Expired

Method of soldering components on a carrier foil

US5878941A · kind A · utility

2Cited by

5References

6Claims

0Family size

Assignee

U.S. Philips Corporation · US

Inventors

Heiko Backer · Hamburg, DE
Reinhard Wendt · Hamburg, DE

Key dates

Filing date	Jul 25, 1996
Grant date	Mar 9, 1999
Priority date	—
Expiry date	Jul 25, 2016

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1581
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The invention relates to a method of soldering components on a carrier foil whereby hot gas is conducted onto the lower side of the carrier foil. Special soldering methods are necessary especially in SMD technology, whereby components can be soldered in large numbers on a carrier foil in a non-destructive manner both for the component itself and for the carrier foil. According to the invention, the hot gas is aimed at a soldering spot through a nozzle, heating this spot until solder heated by the hot gas flow melts on the surface of the carrier foil.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.