Heiko Backer
2Patents
1h-index
6Co-inventors
37Inventor score
Filing activity: Jul 25, 1996 → Oct 16, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5878941A | Method of soldering components on a carrier foil | Electricity | 2 | Expired |
| US9349645B2 | Apparatus, device and method for wafer dicing | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.