Process for producing multilayer printed circuit board for wire bonding
US5879568A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1997 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | Jun 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0554
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.