Daisuke Fujimoto
19Patents
3h-index
52Co-inventors
63Inventor score
Filing activity: Jun 6, 1997 → Jun 25, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5879568A | Process for producing multilayer printed circuit board for wire bonding | Electricity | 71 | Expired |
| US6197149A | Production of insulating varnishes and multilayer printed circuit boards using these varnishes | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6667107B2 | Thermosetting resin composition and use thereof | Emerging Cross-Sectional Technologies | 5 | Expired |
| US8277948B2 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Emerging Cross-Sectional Technologies | 3 | Active |
| US9661763B2 | Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition | Emerging Cross-Sectional Technologies | 3 | Active |
| US7157506B2 | Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate | Emerging Cross-Sectional Technologies | 3 | Expired |
| US8404769B2 | Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate | Emerging Cross-Sectional Technologies | 2 | Active |
| US8568891B2 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Emerging Cross-Sectional Technologies | 2 | Active |
| US7816430B2 | Composition of polycyanate ester and biphenyl epoxy resin | Performing Operations; Transporting | 2 | Active |
| US9873771B2 | Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device | Electricity | 1 | Active |
| US10776484B2 | On-chip monitor circuit and semiconductor chip | Physics | 1 | Active |
| US7078106B2 | Thermosetting resin composition and use thereof | Emerging Cross-Sectional Technologies | 0 | Expired |
| US10034384B2 | Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition | Emerging Cross-Sectional Technologies | 0 | Active |
| US8501870B2 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US11795293B2 | Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device | Electricity | 0 | Active |
| US11049825B2 | Method for producing semiconductor device | Electricity | 0 | Active |
| US10464502B2 | Roof ditch molding end cap | Performing Operations; Transporting | 0 | Active |
| US12264224B2 | Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package | Electricity | 0 | Active |
| US12256490B2 | Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.