Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5882248A · kind A · utility
113Cited by
2References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1997 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | Aug 13, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a planarizing machine for use in chemical-mechanical planarization of semiconductor wafers that has a moveable platen, a polishing pad, a wafer carrier, and a wafer separator. The polishing pad is positioned on the platen, and it has a planarizing surface with an operational zone upon which the wafer may be planarized. The wafer carrier holds a wafer and is positionable opposite the polishing pad to engage the wafer with the operational zone of the polishing pad. The wafer separator engages either the polishing pad, the wafer, or the wafer carrier to urge a portion of the wafer away from the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.