Process for producing semiconductor device
US5882956A · kind A · utility
99Cited by
9References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 21, 1997 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | Jan 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing a wafer dicing/bonding sheet of the present invention comprises a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive layer and a polyimide adhesive layer formed on the processing film. It is preferred that the processing film be a polyethylene naphthalate film whose surface has been subjected to an alkyd release treatment. The present invention facilitates expansion to be conducted after the wafer dicing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.