Ball grid array packaging method for an integrated circuit and structure realized by the method
US5882957A · kind A · utility
26Cited by
2References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 9, 1997 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | Jun 9, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A BGA packaging method for an IC includes steps of providing a first dry film to a copper plate, plating nickel-copper to form circuits on one side of the copper plate, providing a second dry film, selectively plating nickel-gold, removing the dry films, providing an insulating layer, providing a back plate, attaching a chip, wire bonding, encapsulating the chip and wires with plastic, etching copper, providing solder resist and attaching solder balls. By this method, a packaged IC with excellent electrical characteristics and heat dissipation can be obtained through a simple procedure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.