Thermally enhanced flip chip package
US5883430A · kind A · utility
90Cited by
5References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 24, 1997 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | Apr 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.