Personalization structure for semiconductor devices
US5883435A · kind A · utility
209Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1996 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | Jul 25, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The preferred embodiment of the present invention provides a structure and method for personalizing a semiconductor device in the context of a bump array connection to packaging, substrates and such. The preferred embodiment method uses a plurality of conduction lines on said semiconductor device, including a plurality of landing lines and personalization lines. Vias are opened to the plurality of landing lines and selectively opened to a portion of the personalization lines. Connections are made between the opened personalization lines with bumps deposited as part of the bump array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.