William T. Motsiff
67Patents
18h-index
72Co-inventors
87Inventor score
Filing activity: Dec 30, 1983 → Oct 22, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7071532B2 | Adjustable self-aligned air gap dielectric for low capacitance wiring | Electricity | 228 | Expired |
| US5883435A | Personalization structure for semiconductor devices | Electricity | 209 | Expired |
| US6498385B1 | Post-fuse blow corrosion prevention structure for copper fuses | Electricity | 39 | Expired |
| US5795819A | Integrated pad and fuse structure for planar copper metallurgy | Electricity | 37 | Expired |
| US6498056B1 | Apparatus and method for antifuse with electrostatic assist | Electricity | 36 | Expired |
| US5457345A | Metallization composite having nickle intermediate/interface | Electricity | 35 | Expired |
| US7335577B2 | Crack stop for low K dielectrics | Electricity | 31 | Expired |
| US5897336A | Direct chip attach for low alpha emission interconnect system | Electricity | 30 | Expired |
| US5719070A | Metallization composite having nickel intermediate/interface | Electricity | 29 | Expired |
| US6773952B2 | Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces | Electricity | 29 | Expired |
| US6440834B2 | Method and structure for a semiconductor fuse | Electricity | 26 | Expired |
| US5731624A | Integrated pad and fuse structure for planar copper metallurgy | Electricity | 22 | Expired |
| US6512292B1 | Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces | Electricity | 21 | Expired |
| US6806578B2 | Copper pad structure | Electricity | 20 | Expired |
| US6458630B1 | Antifuse for use with low k dielectric foam insulators | Electricity | 19 | Expired |
| US6127735A | Interconnect for low temperature chip attachment | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6093630A | Semi-conductor personalization structure and method | Electricity | 19 | Expired |
| US7521336B2 | Crack stop for low K dielectrics | Electricity | 19 | Active |
| US6667533B2 | Triple damascene fuse | Electricity | 17 | Expired |
| US6844609B2 | Antifuse with electrostatic assist | Electricity | 16 | Expired |
| US4590258A | Polyamic acid copolymer system for improved semiconductor manufacturing | Electricity | 16 | Expired |
| US6958540B2 | Dual damascene interconnect structures having different materials for line and via conductors | Electricity | 16 | Expired |
| US7207096B2 | Method of manufacturing high performance copper inductors with bond pads | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6249038A | Method and structure for a semiconductor fuse | Electricity | 14 | Expired |
| US6924210B1 | Chip dicing | Performing Operations; Transporting | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.