Electronic component for aligning a light transmitting structure
US5883996A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1997 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | Jul 2, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4249
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An electronic component (10) for aligning a light transmitting structure (19) such as an optical fiber or a waveguide, includes a semiconductor substrate (11) which contains or supports at least one semiconductor device (12). To provide electrical isolation and mechanical protection for the semiconductor device (12), a passivation layer (25) is disposed over the semiconductor substrate (11). At least one alignment feature (14) for the light transmitting structure (19) is provided over the passivation layer (25) and over the semiconductor device (12). The alignment feature (14) is manufactured simultaneously during a flip chip bump process which eliminates the necessity for extra processing steps while providing additional alignment functionality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.