Methods of making microelectronic assemblies
US5885849A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1998 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Feb 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06579
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a microelectronic assembly includes providing a starting subassembly having a microelectronic component with a top surface and having electrical contacts, the subassembly further including a plurality of terminals over the top surface of the component, each terminal being connected to at least one contact of the component but moveable with respect to the component; positioning a plurality of joining units each having a solid core on the terminal; providing a unit bonding material at interfaces between each core terminal; and bonding the joining units to the terminals by heating the joining units and terminals so as to convert the unit bonding material to a liquid phase without melting the cores and solidifying the unit bonding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.