TESSERA LLC
856Patents
442Active
856Granted
57Portfolio score
Filing activity: Sep 24, 1991 → Aug 7, 2023 · 126 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6001671A | Methods for manufacturing a semiconductor package having a sacrificial layer | Electricity | 550 | Expired |
| US5518964A | Microelectronic mounting with multiple lead deformation and bonding | Emerging Cross-Sectional Technologies | 478 | Expired |
| US5679977A | Semiconductor chip assemblies, methods of making same and components for same | Emerging Cross-Sectional Technologies | 430 | Expired |
| US5659952A | Method of fabricating compliant interface for semiconductor chip | Emerging Cross-Sectional Technologies | 367 | Expired |
| US5455390A | Microelectronics unit mounting with multiple lead bonding | Emerging Cross-Sectional Technologies | 333 | Expired |
| US5802699A | Methods of assembling microelectronic assembly with socket for engaging bump leads | Emerging Cross-Sectional Technologies | 326 | Expired |
| US6225688A | Stacked microelectronic assembly and method therefor | Electricity | 313 | Expired |
| US5861666A | Stacked chip assembly | Electricity | 309 | Expired |
| US6121676A | Stacked microelectronic assembly and method therefor | Electricity | 290 | Expired |
| US5347159A | Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate | Electricity | 262 | Expired |
| US6294830A | Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer | Electricity | 248 | Expired |
| US7176506B2 | High frequency chip packages with connecting elements | Emerging Cross-Sectional Technologies | 238 | Expired |
| US6177636A | Connection components with posts | Emerging Cross-Sectional Technologies | 233 | Expired |
| US5536909A | Semiconductor connection components and methods with releasable lead support | Emerging Cross-Sectional Technologies | 218 | Expired |
| US5980270A | Soldering with resilient contacts | Emerging Cross-Sectional Technologies | 217 | Expired |
| US6313528A | Compliant multichip package | Electricity | 213 | Expired |
| US6239384A | Microelectric lead structures with plural conductors | Electricity | 209 | Expired |
| US6211572A | Semiconductor chip package with fan-in leads | Electricity | 208 | Expired |
| US5801441A | Microelectronic mounting with multiple lead deformation and bonding | Emerging Cross-Sectional Technologies | 204 | Expired |
| US5688716A | Fan-out semiconductor chip assembly | Electricity | 192 | Expired |
| US6133072A | Microelectronic connector with planar elastomer sockets | Emerging Cross-Sectional Technologies | 191 | Expired |
| US6086386A | Flexible connectors for microelectronic elements | Emerging Cross-Sectional Technologies | 191 | Expired |
| US5258330A | Semiconductor chip assemblies with fan-in leads | Emerging Cross-Sectional Technologies | 181 | Expired |
| US5346861A | Semiconductor chip assemblies and methods of making same | Emerging Cross-Sectional Technologies | 179 | Expired |
| US6117694A | Flexible lead structures and methods of making same | Electricity | 178 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.