Bonding wire inductor for use in an integrated circuit package and method
US5886393A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 1997 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Nov 7, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package assembly is disclosed herein and includes at least one integrated circuit chip having a plurality of chip input/output terminals, an arrangement for providing electrical communication between said input/output terminals and components external to said package, and an electrical inductor arrangement. The electrical inductor arrangement includes an origination terminal, a termination terminal, at least one intermediate connecting surface and a bonding wire positioned within the package. A first segment of the bonding wire is electrically connected with the origination terminal and a second segment is electrically connected with the termination terminal. Furthermore, the bonding wire has at least one intermediate point along it's length physically connected with one intermediate connecting surface. In one embodiment, the bonding wire is continuous along its length. At least two of the bonding wire segments extend in general directions which are non-collinear with respect to one another such that the continuous bonding wire can be electrically energized so as to function as an inductive loop.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.