Crushable bead on lead finger side surface to improve moldability
US5886397A · kind A · utility
182Cited by
5References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 21, 1997 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Aug 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface mount semiconductor package employs locking elements for locking a plastic housing to a metal pad on which a semiconductor device is mounted. The package includes terminals having elongated crushable beads on their side surfaces adjacent the portions of the terminals just outside the plastic housing. The beads are crushed inwardly by a molding tool when it closes to provide a seal which prevents the molding plastic from bleeding out and over the sides of the terminals which extend beyond the housing and which could interfere with solder connection to the terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.