Lead frame and integrated circuit package
US5886399A · kind A · utility
37Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1996 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Sep 18, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame includes a plurality of leads held by an insulative holding film and each formed of an inner lead portion for being bonded to a semiconductor chip and an outer lead portion, a pad portion formed at an end portion of the outer lead portion, an insulating film formed in a pattern so as to insulate the adjacent leads, a ground film formed on the pad portion and partially on the insulating film and having a wider area as compared with that of the pad portion, and a projecting electrode formed on the ground film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.