Stiffeners with improved adhesion to flexible substrates
US5889321A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1997 |
| Grant date | Mar 30, 1999 |
| Priority date | — |
| Expiry date | Jun 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stiffener (34 or 52 or 72) includes a pathway which allows gases and fluids, such as air, to be vented from the interface between surface bonding regions (35 or 60 or 74) of the stiffener and an adhesive (38 or 56 or 80) on a flexible substrate (36 or 54 or 78). The pathway may take the form of a porous material used for the stiffener or one or more bore holes (58 or 59 or 70) formed in the stiffener. The stiffener may also include an internal cavity (76) for promoting venting of fluids and gases. By venting fluid and gases from the adhesive/stiffener interface, better adhesion between the stiffener and flexible substrate is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.