Mark V. Pierson
106Patents
28h-index
103Co-inventors
93Inventor score
Filing activity: May 24, 1976 → Nov 6, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5315227A | Solar recharge station for electric vehicles | Emerging Cross-Sectional Technologies | 281 | Expired |
| US6165885A | Method of making components with solder balls | Electricity | 167 | Expired |
| US6358627B2 | Rolling ball connector | Emerging Cross-Sectional Technologies | 149 | Expired |
| US6497943B1 | Surface metal balancing to reduce chip carrier flexing | Emerging Cross-Sectional Technologies | 131 | Expired |
| US6759738B1 | Systems interconnected by bumps of joining material | Electricity | 113 | Expired |
| US5872051A | Process for transferring material to semiconductor chip conductive pads using a transfer substrate | Electricity | 112 | Expired |
| US5420520A | Method and apparatus for testing of integrated circuit chips | Physics | 92 | Expired |
| US5818107A | Chip stacking by edge metallization | Electricity | 75 | Expired |
| US6399892B1 | CTE compensated chip interposer | Emerging Cross-Sectional Technologies | 55 | Expired |
| US6177729A | Rolling ball connector | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5528159A | Method and apparatus for testing integrated circuit chips | Physics | 51 | Expired |
| US5523696A | Method and apparatus for testing integrated circuit chips | Physics | 51 | Expired |
| US6559666B2 | Method and device for semiconductor testing using electrically conductive adhesives | Electricity | 50 | Expired |
| US5973389A | Semiconductor chip carrier assembly | Electricity | 48 | Expired |
| US6674647B2 | Low or no-force bump flattening structure and method | Emerging Cross-Sectional Technologies | 47 | Expired |
| US6664637B2 | Flip chip C4 extension structure and process | Emerging Cross-Sectional Technologies | 47 | Expired |
| US5545465A | Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits | Emerging Cross-Sectional Technologies | 46 | Expired |
| US8272533B1 | No touch utensil dispenser | Human Necessities | 45 | Active |
| US5478700A | Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5889321A | Stiffeners with improved adhesion to flexible substrates | Electricity | 42 | Expired |
| US5759737A | Method of making a component carrier | Electricity | 39 | Expired |
| US5451131A | Dockable interface airlock between process enclosure and interprocess transfer container | Emerging Cross-Sectional Technologies | 38 | Expired |
| US5796452A | Simplified wiring escape technique for tiled display | Physics | 37 | Expired |
| US6150726A | Component carrier with raised bonding sites | Electricity | 35 | Expired |
| US5565033A | Pressurized injection nozzle for screening paste | Emerging Cross-Sectional Technologies | 34 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.