Sputter coating system and method using substrate electrode
US5891311A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1997 |
| Grant date | Apr 6, 1999 |
| Priority date | — |
| Expiry date | Jun 25, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3438
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus for depositing a film on a substrate includes a housing that encloses a sputtering chamber, a substrate holder for positioning a substrate in the sputtering chamber and a sputtering gun, including a sputtering target, for depositing a film of atoms of the target on a surface of the substrate. The chamber contains a gas which forms a plasma. An electrical potential is applied to the substrate for accelerating ions from the plasma toward the substrate. The apparatus includes a substrate electrode for controlling trajectories of ions accelerated from the plasma toward the substrate. The substrate electrode permits movement of the substrate by the substrate holder and establishes a substantially uniform electrical potential around the periphery of the substrate as viewed from the plasma. The substrate electrode may be biased so that ions substantially uniformly bombard the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.