Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure
US5894882A · kind A · utility
39Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 1996 |
| Grant date | Apr 20, 1999 |
| Priority date | — |
| Expiry date | May 17, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.