Hideaki Yoshimura
38Patents
7h-index
51Co-inventors
72Inventor score
Filing activity: Jan 19, 1994 → Mar 13, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5894882A | Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure | Electricity | 39 | Expired |
| US5751674A | Apparatus for controlling bias amount of focus error signal | Physics | 21 | Expired |
| US5926445A | Waveform controlling device for a tracking error signal | Physics | 14 | Expired |
| US8110749B2 | Printed wiring board | Electricity | 14 | Active |
| US6560173B2 | Servo control apparatus for optical disc player | Physics | 9 | Expired |
| US6576317B2 | Optical disc and injection compression molding die for producing the same | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6334569B1 | Reflow soldering apparatus and reflow soldering method | Electricity | 7 | Expired |
| US8152953B2 | Method of making printed wiring board and method of making printed circuit board unit | Electricity | 6 | Active |
| US5414639A | Automatic testing method and testing apparatus for devices | Physics | 6 | Expired |
| US6777657B2 | Focusing controller for focus jump control between recording layers of multilayer disk | Physics | 6 | Expired |
| US8800142B2 | Package substrate unit and method for manufacturing package substrate unit | Emerging Cross-Sectional Technologies | 5 | Active |
| US8023268B2 | Printed circuit board unit and semiconductor package | Electricity | 5 | Active |
| US7381592B2 | Method of making a semiconductor device with improved heat dissipation | Electricity | 5 | Active |
| US7260806B2 | Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program | Electricity | 4 | Expired |
| US8151456B2 | Method of producing substrate | Emerging Cross-Sectional Technologies | 4 | Active |
| US7222316B2 | Board design aiding apparatus, board design aiding method and board design aiding program | Electricity | 4 | Expired |
| US8186052B2 | Method of producing substrate | Emerging Cross-Sectional Technologies | 4 | Active |
| US9107314B2 | Method of manufacturing a wiring board having via structures | Emerging Cross-Sectional Technologies | 3 | Active |
| US7115444B2 | Semiconductor device with improved heat dissipation, and a method of making semiconductor device | Electricity | 3 | Expired |
| US7199467B2 | Semiconductor device with improved heat dissipation, and a method of making semiconductor device | Electricity | 3 | Expired |
| US8754333B2 | Printed circuit board incorporating fibers | Electricity | 3 | Active |
| US8186053B2 | Circuit board and method of manufacturing the same | Emerging Cross-Sectional Technologies | 2 | Active |
| US6841103B2 | Injection molding apparatus and method | Performing Operations; Transporting | 2 | Expired |
| US6646962B2 | Apparatus for detecting dropout, an error signal extracting unit, and unit for identifying type of dropout in an optical pickup | Physics | 2 | Expired |
| US8161636B2 | Circuit board and method of manufacturing the same | Emerging Cross-Sectional Technologies | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.