Integrated silicon vacuum micropackage for infrared devices
US5895233A · kind A · utility
148Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1997 |
| Grant date | Apr 20, 1999 |
| Priority date | — |
| Expiry date | Sep 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An efficient method brings together two wafers of dies that contain an infrared transparent window or top cap with either an infrared detector or emitter array to produce a low cost infrared package. A low thermal conductivity gas or a vacuum may be used between the wafers for enhanced thermal isolation. Joining of the wafers is preferably by solder, although ultrasonic bonding can be used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.