Semiconductor device
US5895965A · kind A · utility
40Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1997 |
| Grant date | Apr 20, 1999 |
| Priority date | — |
| Expiry date | Sep 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to provide a semiconductor device of high reliability which suppresses a degradation of the fatigue strength of solder connection portions and warping of a tape-type wiring substrate forming the cause of the inferior contact between solder bumps and an external substrate, and a method of manufacturing the semiconductor device, a frame-like member is disposed on the inner peripheral part of the tape-type wiring substrate so as to relax constraint on the thermal deformation of the tape-type semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.