Radial wire bonder and selectable side view inspection system
US5897048A · kind A · utility
12Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 1996 |
| Grant date | Apr 27, 1999 |
| Priority date | — |
| Expiry date | Nov 8, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding machine has a wire bonding head that provides five directions of movement or degrees of freedom. The radial direction of movement supports the wire bonding process and reduces the moving mass of the wire bonder during the generation of the wire bonds. The wire bonding machine further includes a selectable side view inspection system. Through a group of optical components, the assembly process can be selectively viewed from either a side view or a top view. The side view of the assembly process provides for improved analysis of the wire bond quality which can be monitored by a camera.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.