Direct chip attach for low alpha emission interconnect system
US5897336A · kind A · utility
30Cited by
7References
43Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 1997 |
| Grant date | Apr 27, 1999 |
| Priority date | — |
| Expiry date | May 28, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.