Electronic component
US5898128A · kind A · utility
11Cited by
18References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1996 |
| Grant date | Apr 27, 1999 |
| Priority date | — |
| Expiry date | Sep 11, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component (10) has an electrically insulating substrate (20) that is encapsulated with an electrically conductive material (15) to provide thermal dissipation for the electronic component (10). The electrically insulating substrate (20) has cavities (21-24) that are either completely filled with an electrically conductive material (15) or are partially filled to provide recesses (26-27) for electronic devices (30,31). The electronic devices (30,31) are electrically coupled to the leads (60-63) of the electronic component (10) using either wire bonds (70) or metallic depositions (55-57).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.