Inventor · Chandler, AZ, US

Christopher M. Scanlan

70Patents
23h-index
32Co-inventors
88Inventor score

Filing activity: Feb 1, 1996 → Apr 22, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US7777351B1 Thin stacked interposer package Electricity 347 Active
US7633765B1 Semiconductor package including a top-surface metal layer for implementing circuit features Electricity 332 Active
US6686649B1 Multi-chip semiconductor package with integral shield and antenna Electricity 225 Expired
US7550857B1 Stacked redistribution layer (RDL) die assembly package Electricity 142 Active
US8319338B1 Thin stacked interposer package Electricity 130 Active
US7049682B1 Multi-chip semiconductor package with integral shield and antenna Electricity 104 Expired
US7342303B1 Semiconductor device having RF shielding and method therefor Electricity 102 Expired
US7825520B1 Stacked redistribution layer (RDL) die assembly package Electricity 87 Active
US5751552A Semiconductor device balancing thermal expansion coefficient mismatch Electricity 86 Expired
US7745910B1 Semiconductor device having RF shielding and method therefor Electricity 84 Active
US7960827B1 Thermal via heat spreader package and method Electricity 82 Active
US7851894B1 System and method for shielding of package on package (PoP) assemblies Electricity 78 Active
US6546620B1 Flip chip integrated circuit and passive chip component package fabrication method Emerging Cross-Sectional Technologies 57 Expired
US8093691B1 System and method for RF shielding of a semiconductor package Electricity 56 Active
US7898066B1 Semiconductor device having EMI shielding and method therefor Electricity 46 Active
US6356453B1 Electronic package having flip chip integrated circuit and passive chip component Electricity 45 Expired
US8018068B1 Semiconductor package including a top-surface metal layer for implementing circuit features Electricity 42 Active
US9887103B2 Semiconductor device and method of adaptive patterning for panelized packaging Electricity 37 Active
US8629546B1 Stacked redistribution layer (RDL) die assembly package Electricity 36 Active
US8796561B1 Fan out build up substrate stackable package and method Electricity 29 Active
US7507603B1 Etch singulated semiconductor package Electricity 28 Expired
US9040316B1 Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping Electricity 24 Active
US7781852B1 Membrane die attach circuit element package and method therefor Electricity 24 Active
US8227338B1 Semiconductor package including a top-surface metal layer for implementing circuit features Electricity 21 Active
US9177926B2 Semiconductor device and method comprising thickened redistribution layers Electricity 18 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.